High fidelity, high yield production of microfluidic devices by hot embossing lithography : Rheology and stiction

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DOIResolve DOI: http://doi.org/10.1039/b600584e
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TypeArticle
Journal titleLab on a chip
Volume6
Issue7
Pages936941; # of pages: 6
AbstractWe discuss thermoforming of thermoplastic polymers for the hot-embossing lithographic (HEL) fabrication of microfluidic chips near equilibrium conditions that minimize elastic recoil for optimal motif replication. While HEL is often simplistically described as the transfer of micro- and nano-motifs into heat-softened thermoplastic materials, we describe our rational approach to selecting appropriate processing parameters.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); NRC Industrial Materials Institute
Peer reviewedYes
NRC number48856
NPARC number15878011
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Record identifier00b6b34d-77c7-4908-9e3c-d6462590050e
Record created2010-07-30
Record modified2016-05-09
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