Fluorinated aminoalkoxide CuII complexes : new CVD precursors for deposition of copper metal

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DOIResolve DOI: http://doi.org/10.1039/b205419a
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TypeArticle
Journal titleJournal of Materials Chemistry
Volume12
Issue12
Pages35413550; # of pages: 10
AbstractVolatile low-melting CuII metal complexes of formula Cu[OC(CF3)R1CH2NHR2]2 (R1= CF3 or CH3; R2= CH2CH2OMe, Bui, or But) and Cu[OC(CF3)R1CH2NMe2]2 (R1= CF3 or CH3) have been synthesized and characterized by spectroscopic methods. A single-crystal X-ray diffraction study on Cu[OC(CF3)2CH2NHCH2CH2OMe]2 shows that one methoxyethyl group of the aminoalkoxide ligand forms an intramolecular dative bond to the Cu atom to produce a square-pyramidal geometry at the metal center, while the second is linked to the Cu atom of the adjacent molecule, giving an N2O4 octahedral coordination arrangement. For the second Bui-substituted complex, Cu[OC(CF3)2CH2NHBui]2, the X-ray structural analysis demonstrated an N2O2 square-planar geometry, with one alkoxide oxygen atom forming strong H-bonding to an adjacent water molecule. Metal CVD experiments were carried out, showing that the source reagents Cu[OC(CF3)2CH2NHBui]2, Cu[OC(CF3)2CH2NHBut]2, and Cu[OCMe(CF3)CH2NHBui]2, which possess a secondary amino group, are capable of depositing copper metal at temperatures of 250-300 [degree]C under inert Ar carrier gas, while Cu[OCMe(CF3)CH2NMe2]2, with a tertiary amine group, requires the use of reductive H2 carrier gas to induce metal deposition at lower temperatures.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada; NRC Steacie Institute for Molecular Sciences
Peer reviewedNo
NPARC number12337895
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Record identifier07d6ef68-5ba2-4af5-a260-c46f35068772
Record created2009-09-10
Record modified2016-05-09
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