Engineering light at the sub-wavelength scale using silicon photonics

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DOIResolve DOI: http://doi.org/10.1117/12.875488
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TypeArticle
Proceedings titleProceedings of SPIE - The International Society for Optical Engineering
ConferenceSilicon Photonics VI, 23 January 2011 through 26 January 2011, San Francisco, CA
ISSN0277-786X
ISBN9780819484802
Volume7943
Article number79430G
SubjectCladding layer; Electric field profiles; Etch depth; Grating couplers; High-index contrast waveguides; Length scale; Lithographic patterning; Molecular monolayer; Optical bio-sensors; Optical structures; Segmented waveguides; Semi-conductor fabrication; Silicon photonics; Sub-wavelength; Waveguide core; Biosensors; Electric fields; Integrated optics; Light; Metamaterials; Monolayers; Nanophotonics; Optical instruments; Optical materials; Optical properties; Photonic devices; Semiconductor devices; Waveguides; Photonics
AbstractAs a result of the evolution semiconductor fabrication tools and methods over several decades, it now possible to routinely design and make optical devices with features comparable to or smaller than the wavelength of the light that propagates through these structures. This paper will review some silicon optical structures with critical features at these extremely short length scales. For example it becomes possible to create segmented waveguide structures with optical properties that can be tuned continuously between those of the cladding and waveguide core, using lithographic patterning rather than varying etch depth. Using thin high index contrast waveguides and the correct polarization, the optical electric field profiles can be shaped to maximize the coupling to molecular monolayers or cladding layers with specific functionality. Examples are given from our recent work on optical biosensors chips which employ grating couplers made by sub-wavelength digital patterning, and use waveguides optimized for coupling to molecular monolayers.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); NRC Institute for Microstructural Sciences
Peer reviewedYes
NPARC number21271367
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Record identifier083e6d73-5579-4ac0-b38e-33f725c5f071
Record created2014-03-24
Record modified2016-05-09
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