An electrochemical approach to total organic carbon control in printed circuit board copper sulfate plating baths Part II: Overfall system

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TypeArticle
Journal titleJournal of Applied Electrochemistry
Volume32
Pages13031311; # of pages: 9
Subjectelectgrooxidation; membrane selectivity; plating bath purification
AbstractAn electrochemical system for oxidative removal of high levels of total organic carbon (TOC) in printed circuit board (PCB) copper sulfate plating baths has been developed. These organic contaminants build-up over the course of pattern plating of PCBs, and at high concentrations they interfere with the quality of the plated copper. The chemistry of the electrochemical oxidation of the plating bath contaminants was qualitatively followed using high performance liquid chromatography (HPLC) and chemical oxygen demand (COD) measurements. A complete treatment system is described and rough calculations are given showing, for a given set of conditions, how the proper choice of electrode material and current density can minimize the system cost.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); NRC Institute for Chemical Process and Environmental Technology; NRC Industrial Materials Institute
Peer reviewedYes
NRC number52295
NPARC number16293128
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Record identifier25a04b1d-64d1-4394-b151-7684571aea96
Record created2010-11-01
Record modified2016-05-09
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