High-directionality fiber-chip grating coupler with interleaved trenches and subwavelength index-matching structure

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DOIResolve DOI: http://doi.org/10.1364/OL.40.004190
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TypeArticle
Journal titleOptics Letters
ISSN0146-9592
Volume40
Issue18
Pages41904193; # of pages: 4
AbstractWe present the first experimental demonstration of a new fiber-chip grating coupler concept that exploits the blazing effect by interleaving the standard full (220 nm) and shallow etch (70 nm) trenches in a 220 nm thick silicon layer. The high directionality is obtained by controlling the separation between the deep and shallow trenches to achieve constructive interference in the upward direction and destructive interference toward the silicon substrate. Utilizing this concept, the grating directionality can be maximized independent of the bottom oxide thickness. The coupler also includes a subwavelength-engineered index-matching region, designed to reduce the reflectivity at the interface between the injection waveguide and the grating. We report a measured fiber-chip coupling efficiency of −1.3  dB , the highest coupling efficiency achieved to date for a surface grating coupler in a 220 nm silicon-on-insulator platform fabricated in a conventional dual-etch process without high-index overlays or bottom mirrors.
Publication date
LanguageEnglish
AffiliationInformation and Communication Technologies; National Research Council Canada
Peer reviewedYes
NPARC number21276295
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Record identifier36147e8e-3cb9-4d1c-9aa8-27a190af8695
Record created2015-09-30
Record modified2016-05-09
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