Laser shock waves for adhesive bond testing

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TypeArticle
Proceedings titleProceeding of the Society for the Advancement of Material and Process Engineering (SAMPE 2010)
ConferenceSociety for the Advancement of Material and Process Engineering (SAMPE 2010), May 17-20, 2010, Seattle, Washington, USA
Pages# of pages: 15
AbstractA method based on shock waves produced by a pulsed laser is used for evaluating the bond strength between composite laminates. The laser shock wave can cause a disbond when it propagates through the adhesive/laminate interface. A good bond is unaffected by certain level of shock wave stress whereas a weaker is damaged. The method is made quanitative and in-situ by optically measuring the sample back surface velocity with a Doppler or velocity interferometer. The interferometer signal allows distinguishing interfaces that pass the test from the ones that fail and provide an estimate of the bond strength. Experimental results confirmed by numerical simulation show that the proposed test is able to differentiate bond quality. Laser-ultrasonic inspection made on laser shock tested samples confirms that weak bonds are revealed by the method.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); NRC Industrial Materials Institute
Peer reviewedYes
NRC number52440
NPARC number15651315
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Record identifier370783b1-de31-4418-95ca-509d013d39df
Record created2010-06-10
Record modified2016-05-09
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