Self-reducible CuII source reagents for the CVD of copper

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DOIResolve DOI: http://doi.org/10.1002/1521-3862(200101)7:1<28::AID-CVDE28>3.0.CO;2-6
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TypeArticle
Journal titleChemical Vapor Deposition
Volume7
Issue1
Pages2831; # of pages: 4
SubjectAminoalkoxide precursors; Copper; CVD
AbstractHigh purity copper metal is deposited from highly volatile copper complexes at temperatures near 250 °C. SEM shows a dense microstructure and relatively small grain size (see Figure), with one of the complexes producing copper with a measured electrical resistivity of 3.4 μΩ cm, very close to the physical resistivity value of bulk copper and copper with a purity of over 99 %.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada; NRC Steacie Institute for Molecular Sciences
Peer reviewedNo
NPARC number12339077
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Record identifier3f10e1d3-4c32-4915-8a3f-2623a29bc07e
Record created2009-09-11
Record modified2016-05-09
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