Transient Liquid Phase Bonding of Cu to Cu-W Alloy using an Electron Beam Energy Source

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DOIResolve DOI: http://doi.org/10.1016/j.ijrmhm.2006.01.001
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TypeArticle
Journal titleInternational Journal of Refractory Metal and Hard Materials.
SubjectTransient Liquid Phase Bonding; Electron Beam Welding; Cu alloys; Electrical Contacts
AbstractThis paper presents an alternative method for fabricating Cu/Cu–W joints suitable for electrical contacts. The process applied to join the Cu to the Cu–W composite involved using an electron beam welding machine operated in conduction mode to form a transient liquid phase at the interface from the melting of a thin Al foil. Analysis of the microstructure of the joints indicated that for optimized processing conditions, Cu–Al intermetallics were not present in the Cu/Cu–W interfacial region. For the joints with such microstructural characteristics, measurement of the mechanical integrity of the interface between the Cu and Cu–W composite indicated that plastic deformation and fracture occurs at the copper side of the assembly.
Publication date
AffiliationNRC Institute for Aerospace Research; National Research Council Canada
Access conditionavailable
unclassified
unlimited
Peer reviewedNo
NRC numberAMTC-2005-0053
NPARC number8929618
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Record identifier43a14bdd-a051-49f8-b1be-734392ba7f9f
Record created2009-04-23
Record modified2016-05-09
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