Composite spreader for cooling computer chip with non-uniform heat dissipation

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DOIResolve DOI: http://doi.org/10.1109/TCAPT.2008.916847
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TypeArticle
Journal titleIEEE Transactions on Components and Packaging Technologies
Volume31
IssueMarch 1
Pages165172; # of pages: 8
Subjectcomposite spreader, copper (CU), dielectric liquid, high-power chip, non-uniform heat flux, nucleate boiling, porous graphite (PG), power dissipation, thermal resistance; Fire
Publication date
LanguageEnglish
AffiliationNRC Institute for Research in Construction; National Research Council Canada
Peer reviewedYes
NRC number50573
19772
NPARC number20326261
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Record identifier46a64994-85f4-4514-8506-d66da83a5828
Record created2012-07-18
Record modified2016-05-09
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