A true-stress creep model based on deformation mechanisms for polycrystalline materials

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DOIResolve DOI: http://doi.org/10.1007/s11665-012-0191-6
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TypeArticle
Journal titleJournal of Materials Engineering and Performance
ISSN1059-9495
1544-1024
Volume21
Issue11
Pages22552262; # of pages: 8
Subjectcreep; creep life prediction; deformation mechanism
AbstractA true-stress creep model has been developed based on well-recognized deformation mechanisms, i.e., dislocation glide, dislocation climb, and grain boundary sliding. The model provides a physics-based description of the entire creep deformation process with regards to the strain-time history (primary, secondary, and tertiary creep), rupture strain and lifetime, which finds good agreement with experimental observations for Waspaloy. A deformation-mechanism map is constructed for Waspaloy, and a creep failure criterion is defined by the dominant deformation mechanisms leading to intergranular/transgranular fracture. Thus, the model is a self-consistent tool for creep life prediction.
Publication date
LanguageEnglish
AffiliationAerospace; National Research Council Canada
Peer reviewedYes
Identifier191
NPARC number21268424
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Record identifier5366c419-2c6c-4611-b6b3-df72b2c10663
Record created2013-07-11
Record modified2016-05-09
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