Numerical modeling of hot embossing process for manufacturing of microcomponents

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TypeArticle
Journal titlePolymer Engineering and Science
Pages# of pages: 34
AbstractHot embossing is a compression molding technique used for high replication accuracy of small features. One of the most sensitive phases of the process is the de-embossing stage during which the patterned part has to be demolded. In this paper, the demolding stage is considered as a frictional contact problem between a rigid mold insert and a viscoelastic polymer sheet as it deforms and cools inside a mold under an applied force. The contact is modeled with a modified Coulomb's law of dry friction while a generalized Maxwell model is used to describe the polymer behavior during embossing, cooling and de-embossing stages. The heat transfer between the mold insert and the patterned polymer sheet is solved through a domain decomposition method. A finite element approximation based on a penalized technique is proposed and analyzed. The purpose of this modeling approach is to predict dimensional stability and residual shape of microcomponenets in the hot embossing process. Such a prediction will allow one to assign appropriate processing conditions that minimize geometrical imperfections and increase replication accuracy.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); NRC Industrial Materials Institute
Peer reviewedYes
NRC number50596
NPARC number15859842
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Record identifier5aecf7d4-aea1-43a7-a234-15b125621a2a
Record created2010-07-30
Record modified2016-05-09
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