The influence of processing parameters on TLP joining of Inconel 617 alloy

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ConferenceSecond International Symposium on Aerospace Materials: Development, Testing and Life Cycle Issues - Honoring William Wallace, COM 2004, pp.263-274, Aug. 22-25, 2004 From 08/22/2004 To 08/25/2004., Hamilton / Canada
SubjectInconel 617; Transient liquid phase bonding; microstructure control
AffiliationNRC Institute for Aerospace Research; National Research Council Canada
Access conditionavailable
Peer reviewedYes
NRC numberAMTC-2005-0047
NPARC number8930202
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Record identifier5f22b33b-bb1a-4385-b0f3-d891a3854fd6
Record created2009-04-23
Record modified2016-05-09
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