Polymer peel-off mask for high-resolution surface derivatization, neuron placement and guidance

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DOIResolve DOI: http://doi.org/10.1002/bit.24887
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TypeArticle
Journal titleBiotechnology and Bioengineering
ISSN0006-3592
Volume110
Issue8
Pages22362241; # of pages: 6
Subjectchemical patterning; process guidance; dry lift-off; neural network
AbstractWe present a dry lift-off method using a chemically resistant spin-on plastic, polyimide, to pattern surfaces with high accuracy and resolution. Using well-known lithographic and reactive ion etching techniques, the spin-on polymer is patterned over a silicon dioxide surface. The plastic efficiently adheres to the silicon dioxide surface during the chemical modification and is readily lifted-off following the derivatization process, permitting highly reliable surface derivatization. The verticality of the reactive ion etch enables sub-micrometer features to be patterned, down to 0.8μm. The technique is used to pattern neurons on silicon dioxide surfaces: efficient neuron placement over a 4mm area is shown for patterns larger than 50μm while process guidance is shown for 10μm patterns.
Publication date
LanguageEnglish
AffiliationInformation and Communication Technologies; National Research Council Canada
Peer reviewedYes
NPARC number21270703
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Record identifier5f776607-e59c-47e8-9e25-d6d65854d521
Record created2014-02-17
Record modified2016-05-09
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