Temperature changes during deformation of polycrystalline and nanocrystalline nickel

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DOIResolve DOI: http://doi.org/10.4028/www.scientific.net/AMR.409.480
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TypeArticle
Proceedings titleAdvanced Materials Research
Conference7th International Conference on Processing and Manufacturing of Advanced Materials, THERMEC'2011, 1 August 2011 through 5 August 2011, Quebec City, QC
ISSN1022-6680
ISBN9783037853047
Volume409
Pages480485; # of pages: 6
SubjectGrain size; Heat zone; High resolution; Maximum temperature; Nano-crystalline nickel; Nanocrystallines; Onset temperature; Polycrystalline; Room temperature; Stress-induced; Temperature changes; True stress-strain; Deformation; Grain size and shape; Heat generation; Nanocrystalline materials; Nickel; Polycrystalline materials; Strain rate; Stress-strain curves; Grain growth
AbstractCommercially available polycrystalline nickel (grain size: 30 μm) and electrodeposited nanocrystalline nickel (grain size: 30 nm) were analyzed for the effect of stress-induced heat generation during plastic deformation at room temperature. Tensile coupons in conformance to ASTM E8 standard were tested at a strain rate of 10 -1/s to record the amount heat dissipated using a high resolution infrared detector. The maximum temperature increases recorded for nanocrystalline and polycrystalline nickel close to sample fracture were 58° and 70°, respectively. Grain growth in nanocrystalline nickel due to stress-induced heat generation is unlikely since the maximum temperature during deformation is below the previously reported onset temperature for grain growth in nanocrystalline nickel. © (2012) Trans Tech Publications, Switzerland.
Publication date
LanguageEnglish
AffiliationNational Research Council Canada (NRC-CNRC); Aerospace (AERO-AERO)
Peer reviewedYes
NPARC number21269360
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Record identifier631afc62-94e3-4efa-a2b7-8b07dc85560d
Record created2013-12-12
Record modified2016-05-09
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