High effectiveness of the organic-bonding process in reducing the Ni, Cu and Fe dusting in a production environment

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Conference2008 World Congress on Powder Metallurgy & Particulate Materials, June 8-12, 2008, Washington, DC, USA
Pages115; # of pages: 15
Subjectorganic-bonding process; binder-treatment blending technique; compacting behavior; ejection behavior
Publication date
PublisherNational Research Council of Canada
AffiliationNRC Industrial Materials Institute (IMI-IMI); National Research Council Canada
Access conditionavailable
Peer reviewedYes
NRC number50599
NPARC number11784576
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Record identifier6a751ca4-21d9-4200-84fd-10ec79e5f400
Record created2009-10-03
Record modified2016-05-09
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