A stress-free packaging solution for planar waveguide-based photonic components

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DOIResolve DOI: http://doi.org/10.1109/LPT.2005.845682
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TypeArticle
Journal titlePhotonics Technology Letters
Volume17
Issue5
Pages10821084; # of pages: 3
Publication date
AffiliationNRC Institute for Microstructural Sciences; National Research Council Canada
Peer reviewedNo
NPARC number12744817
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Record identifier7066b5b8-96b8-469d-a4ea-19268d4ed2e4
Record created2009-10-27
Record modified2016-05-09
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