A comparative study on mechanical and electrical properties of SWCNT-modified epoxy resins and their end-use applications

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DOIResolve DOI: http://doi.org/10.2514/6.2012-1725
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TypeArticle
Proceedings title53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference 2012
Series titleCollection of Technical Papers - Structures, Structural Dynamics and Materials Conference (AIAA/ASME/ASCE/AHS/ASC)
Conference53rd AIAA/ASME/ASCE/AHS/ASC Structures, Structural Dynamics and Materials Conference 2012, April 23-26, 2012, Honolulu, Hawaii
ISSN0273-4508
ISBN9781600869372
SubjectElectrical conductivity; Electrical resistances; Interlaminar fracture toughness; Interlaminar properties; Mechanical and electrical; Mechanical and electrical properties; Mechanical performance; Mode-i fracture toughness; Aluminum; Epoxy resins; Fracture toughness; Resins; Structural dynamics; Electric conductivity
AbstractIn this work, the influence of SWCNTs on electrical and mechanical performance of two epoxy resins was studied. In the first study, a small quantity of SWCNTs (0.125 wt%) was incorporated into a high-temperature aerospace-grade epoxy. After the modification with SWCNTs, the correlation between bulk properties of this epoxy (electrical conductivity and Mode I fracture toughness) and the properties of epoxy/glass fiber laminates (inplane/ transverse electrical conductivity and Mode I interlaminar fracture toughness) was investigated. It was found that the electrical property improvements of nano-modified laminates exceeded those of bulk SWCNT-modified epoxy. On the other hand, the fracture toughness improvement of bulk epoxy after the addition of SWCNTs did not translate into interlaminar properties enhancement, possibly due to reduction of the nano-modified resin's ability to interact with glass fiber mats. In the second study, the mechanical and electrical performance of a SWCNT-modified epoxy adhesive was studied for aluminum-to-aluminum bonding. It was found that the integration of 1 wt% SWCNTs can considerably improve joint Mode I fracture toughness by ~ 35% due to mechanisms such as crack bridging. The electrical resistance of the bondline was also consistent with the electrical conductivity of SWCNT-modified adhesive films (~10-3 S/m), but somewhat lower than the bulk electrical conductivity measured on thicker samples. © 2012 by Canada National Research Council.
Publication date
LanguageEnglish
AffiliationAerospace; Security and Disruptive Technologies; National Research Council Canada
Peer reviewedYes
NPARC number21270014
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Record identifier769fe6ed-22fb-4a2c-b4f0-015472a66d7a
Record created2013-12-13
Record modified2016-05-09
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