Fiber-chip grating coupler based on interleaved trenches with directionality exceeding 95%

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DOIResolve DOI: http://doi.org/10.1364/OL.39.005351
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TypeArticle
Journal titleOptics Letters
ISSN0146-9592
Volume39
Issue18
Pages53515354; # of pages: 4
SubjectGrating couplers
AbstractWe propose a fiber-chip grating coupler that interleaves the standard full and shallow etch trenches in a 220 nm thick silicon layer to provide a directionality upward exceeding 95%. By adjusting the separation between the two sets of trenches, constructive interference is achieved in the upward direction independent of the bottom oxide thickness and without any bottom reflectors, overlays, or customized etch depths. We implement a transverse subwavelength structure in the first two grating periods to minimize back-reflections. The grating coupler has a calculated coupling efficiency of CE ~ -1.05 dB with a 1 dB bandwidth of 30 nm and minimum feature size of 100 nm, compatible with deep-UV lithography.
Publication date
PublisherOSA Publishing
LanguageEnglish
AffiliationNational Research Council Canada; NRC Institute for Microstructural Sciences
Peer reviewedYes
NPARC number21272925
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Record identifier777f5949-2649-48bd-ac4d-c122e7010da9
Record created2014-12-03
Record modified2016-05-09
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