Copper immersion deposition on magnesium alloy: the effect of fluoride and temperature

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DOIResolve DOI: http://doi.org/10.1149/1.1923728
AuthorSearch for: ; Search for:
TypeArticle
Journal titleJournal of the Electrochemical Society
Volume152
Issue7
Pages474481; # of pages: 8
Subjectcopper; magnesium alloys; electric impedance; x-ray photoelectron spectra; scanned electron microscopy; electroless deposition; corrosion protective coatings
AbstractA study was carried out to examine copper immersion deposition on AZ91 magnesium alloy in a hydrofluoric acid-containing bath. The role of fluoride and the effect of bath temperature were investigated. The study was performed by measuring the ac impedance and open-circuit potentials in combination with X-ray photoelectron spectroscopy and scanning electron microscopy surface analysis. Results showed that the effect of both HF concentration and temperature on copper immersion deposition is significant, via affecting the surface film formation on the magnesium surface. A model for understanding the copper immersion deposition process is depicted based on surface characterization and the electrochemical measurements.
Publication date
LanguageEnglish
AffiliationNRC Industrial Materials Institute; National Research Council Canada
Peer reviewedYes
NPARC number21272543
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Record identifier7997ba7b-b33c-40c6-81be-87b2bdbe0370
Record created2014-12-02
Record modified2016-05-09
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