Single-etch subwavelength engineered fiber-chip grating couplers for 13 µm datacom wavelength band

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DOIResolve DOI: http://doi.org/10.1364/OE.24.012893
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TypeArticle
Journal titleOptics Express
ISSN1094-4087
Volume24
Issue12
Pages1289312904
AbstractWe report, for the first time, on the design and experimental demonstration of fiber-chip surface grating couplers based on subwavelength grating engineered nanostructure operating in the low fiber chromatic dispersion window (around 1.3 μm wavelengths), which is of great interest for short-reach data communication applications. Our coupler designs meet the minimum feature size requirements of large-volume deep-ultraviolet stepper lithography processes. The fiber-chip couplers are implemented in a standard 220-nm-thick silicon-on-insulator (SOI) platform and are fabricated by using a single etch process. Several types of couplers are presented, specifically the uniform, the apodized, and the focusing designs. The measured peak coupling efficiency is −2.5 dB (56%) near the central wavelength of 1.3 μm. In addition, by utilizing the technique of the backside substrate metallization underneath the grating couplers, the coupling efficiency of up to −0.5 dB (89%) is predicted by Finite Difference Time Domain (FDTD) calculations.
Publication date
PublisherThe Optical Society
LanguageEnglish
AffiliationInformation and Communication Technologies; National Research Council Canada
Peer reviewedYes
NPARC number23000134
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Record identifierc68c8a52-834f-4063-964a-ff96aeb5e037
Record created2016-06-07
Record modified2016-06-07
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