Adhesives in The Packaging of Planar Lightwave Circuits

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DOIResolve DOI: http://doi.org/10.1016/j.ijadhadh.2003.11.003
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TypeArticle
Journal titleInternational Journal of Adhesion and Adhesives
Volume24
Issue4
Pages313318; # of pages: 6
Publication date
AffiliationNRC Institute for Microstructural Sciences; National Research Council Canada
Peer reviewedNo
NPARC number12744138
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Record identifierd1d4daf6-1e0f-47ef-8a67-9ad39bf3be32
Record created2009-10-27
Record modified2016-05-09
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