Dynamic wetting spread factors and interfacial heat transfer coefficients in the solidification of aluminum droplets on copper substrates

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ConferenceConference of Metallurgists (COM) 2005, August 21-24, 2005, Calgary, Alberta, Canada
SubjectDynamic wetting; spread factors; interfacial heat transfer coefficients; solidification; aluminum; aluminium; droplets; copper substrates
Publication date
AffiliationNational Research Council Canada; NRC Industrial Materials Institute
Peer reviewedNo
NRC number51109
NPARC number12921154
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Record identifiere4b44ba3-4126-4927-99d4-e8f5dd8b13b8
Record created2009-11-12
Record modified2016-05-09
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