Numerical simulation of a thermoviscoelastic frictional problem with application to the hot-embossing process for manufacturing of microcomponents

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DOIResolve DOI: http://doi.org/10.3139/217.2227
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TypeArticle
Journal titleInternational Polymer Processing
Volume2009
IssueMay 2
Pages174184; # of pages: 11
SubjectThermoviscoelastic Frictional Problem; Hot embossing; compression molding technique; de-embossing stage
Publication date
PublisherCarl Hanser Verlag
Copyright noticeMaterial in this document is covered by the provisions of the Copyright Act, by Canadian laws, policies, regulations and international agreements. Such provisions serve to identify the information source and, in specific instances, to prohibit reproduction of materials without written permission.
LanguageEnglish
AffiliationNRC Industrial Materials Institute (IMI-IMI); National Research Council Canada
Access conditionavailable
unlimited
public
Peer reviewedYes
NRC number52363
NPARC number10976299
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Record identifierebbddc80-4abc-47f7-974a-4f0187a9f18c
Record created2009-10-03
Record modified2016-05-09
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