Environmental effects on the dimensions of SL5195 resin

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DOIResolve DOI: http://doi.org/10.1108/13552540310698152
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TypeArticle
Journal titleRapid Prototyping Journal
ISSN1355-2546
Volume9
Issue2
Pages8894; # of pages: 7
Subjectresins; rapid prototyping; stereolithography
AbstractThe effect of humidity, temperature and temperature ramping rate on the dimensional changes of the photo-cured stereolithography (SL) resin SL5195 was investigated. It was found that moisture absorption by the SL resin is a very slow process at ambient temperatures. Varying relative humidity (RH) between 20 and 90 per cent in the environment only produced slight changes in the sample dimensions during the time period investigated. Increasing the environment temperature caused a significant increase in the sample dimensions through thermal expansion along with accelerated moisture absorption at 50 per cent or higher RH. Increasing the temperature ramping rate reduces the moisture absorption during the thermal cycles.
Publication date
LanguageEnglish
AffiliationNRC Industrial Materials Institute; National Research Council Canada
Peer reviewedYes
NPARC number21272973
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Record identifierada1037f-318e-4d2e-a015-c8d5fbd5bbcb
Record created2014-12-03
Record modified2016-05-09
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